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osídlenie ekológia orient cross section inter metalic layer týždenné výročie problém

Materials | Free Full-Text | Suppression of the Growth of Intermetallic  Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy  Sn–Ag–Cu Solder on a Cu Substrate
Materials | Free Full-Text | Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate

Wetting and the reaction of multiwalled carbon nanotube-reinforced  composite solder with a copper substrate
Wetting and the reaction of multiwalled carbon nanotube-reinforced composite solder with a copper substrate

Microsection | BGA Cross Section Analysis
Microsection | BGA Cross Section Analysis

Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces  in Cu/Sn/Cu interconnects under temperature gradient | Scientific Reports
Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient | Scientific Reports

Controlling Interfacial Reactions and Intermetallic Compound Growth at the  Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred  Graphene | ACS Applied Materials & Interfaces
Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene | ACS Applied Materials & Interfaces

Formation and growth of intermetallic compound layers at the interface  during laser soldering using Sn–Ag Cu solder on a Cu Pad - ScienceDirect
Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn–Ag Cu solder on a Cu Pad - ScienceDirect

Cross-Sectional Analysis — Elmet
Cross-Sectional Analysis — Elmet

Cross-section BSE images of the interfacial IMC layers before assembly:...  | Download Scientific Diagram
Cross-section BSE images of the interfacial IMC layers before assembly:... | Download Scientific Diagram

Hurtony Tamás
Hurtony Tamás

Modeling of interfacial intermetallic compounds in the application of very  fine lead-free solder interconnections | SpringerLink
Modeling of interfacial intermetallic compounds in the application of very fine lead-free solder interconnections | SpringerLink

Applying microscopic analytic techniques for failure analysis in electronic  assemblies | Applied Microscopy | Full Text
Applying microscopic analytic techniques for failure analysis in electronic assemblies | Applied Microscopy | Full Text

Mounted Part Defects/Reliability Tests of Solder - JFE Techno-Research  Corporation
Mounted Part Defects/Reliability Tests of Solder - JFE Techno-Research Corporation

Microsection / Cross-Section Analysis
Microsection / Cross-Section Analysis

What is IMC (Intermetallic Compound) in the electronic manufacturing  industry? | I am a Manufacturing Process Engineer (MPE)
What is IMC (Intermetallic Compound) in the electronic manufacturing industry? | I am a Manufacturing Process Engineer (MPE)

What are Intermetallics and How Can We Overcome the Failures Associated  with Them?
What are Intermetallics and How Can We Overcome the Failures Associated with Them?

Cross-Sectional Analysis — Elmet
Cross-Sectional Analysis — Elmet

Effects of Reflow Profile and Thermal Conditioning on Intermetallic  Compound Thickness for SnAgCu Soldered Joints
Effects of Reflow Profile and Thermal Conditioning on Intermetallic Compound Thickness for SnAgCu Soldered Joints

BGA Solder Joint Microsection - SEM Lab Inc.
BGA Solder Joint Microsection - SEM Lab Inc.

The cross sections of the as-diffusion alloyed intermetallic layer... |  Download Scientific Diagram
The cross sections of the as-diffusion alloyed intermetallic layer... | Download Scientific Diagram

The Role of Aluminium in Continuous Galvanizing - Ark Novin
The Role of Aluminium in Continuous Galvanizing - Ark Novin

Crystals | Free Full-Text | Formation Mechanism of Porous Cu3Sn  Intermetallic Compounds by High Current Stressing at High Temperatures in  Low-Bump-Height Solder Joints
Crystals | Free Full-Text | Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints

The intermetallic layer of solder joints: a) Infrared heating method, |  Download Scientific Diagram
The intermetallic layer of solder joints: a) Infrared heating method, | Download Scientific Diagram

Evaluation of intermetallic compound layer at aluminum/steel interface  joined by friction stir scribe technology - ScienceDirect
Evaluation of intermetallic compound layer at aluminum/steel interface joined by friction stir scribe technology - ScienceDirect

Effect of shape-memory alloy NiTi fiber on microstructure and mechanical  properties of continuous ceramic Al2O3 fiber-reinforced Ti/Al3Ti metal– intermetallic laminated composite - Yuqiang Han, Junyi Zhu, Haoran Yan,  Chunfa Lin, Zhilei Zhao, Xuecong
Effect of shape-memory alloy NiTi fiber on microstructure and mechanical properties of continuous ceramic Al2O3 fiber-reinforced Ti/Al3Ti metal– intermetallic laminated composite - Yuqiang Han, Junyi Zhu, Haoran Yan, Chunfa Lin, Zhilei Zhao, Xuecong

Applied Sciences | Free Full-Text | Influence of Interfacial Intermetallic  Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme  Temperature Thermal Shock
Applied Sciences | Free Full-Text | Influence of Interfacial Intermetallic Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme Temperature Thermal Shock

Figure 10 from Investigating the mechanical strength of Vapor Phase  soldered chip components joints | Semantic Scholar
Figure 10 from Investigating the mechanical strength of Vapor Phase soldered chip components joints | Semantic Scholar